Digital Twin Intelligence for Semiconductor Manufacturing
Connect fab data, detect anomalies, and accelerate root-cause investigation.
Zigoraat brings fragmented fab data into one vendor-agnostic intelligence workflow for defect review, signal correlation, and engineering decision support.
Example: review lot, inspect signal deviation, compare recent runs.
Ask about defect cluster…
Semiconductor fabs are data-rich but insight-poor.
Fab teams work across disconnected tools, recipes, wafers, and data systems. When defects appear, engineers must rebuild context manually.
One vendor-agnostic intelligence layer for fab data workflows.
Zigoraat organizes fab data into a shared investigation layer for engineering teams.
- Connect metrology, inspection, process, MES, SPC, and yield data
- Normalize fragmented tool and system context
- Correlate signals across wafers, lots, recipes, and defects
Workflow example — not production performance metrics
What Zigoraat connects
Key data domains for fab investigation.
Electron Microscopy / Inspection
SEM images, defects, measurements, and review context.
Metrology
Dimensional data, wafer variation, and process indicators.
Process Tools
Recipe context, chamber signals, and run history.
MES / SPC
Lot history, control charts, and process windows.
Yield
Wafer trends, failure patterns, and downstream indicators.
Engineering Knowledge
Notes, reports, review steps, and feedback.
How Zigoraat works across fab data.
Connect
Bring fab data into one workflow.
Normalize
Organize fragmented context.
Correlate
Link signals across tools and wafers.
Guide
Surface review paths and next steps.
From tool to intelligence.
Tool guidance, image analysis, and engineering review in one view.
Prototype / example workflow
Tool Guidance
Structured context during capture and review.
Image Analysis
Defects, measurements, and regions organized for review.
Engineering Review
Signals prepared for comparison and next-step decisions.
Built for the people who run the fab floor.
One investigation layer for teams across process, metrology, inspection, and yield.
Workflow benefits without OEM lock-in.
Faster root-cause workflows
Less manual data stitching across tools, wafers, recipes, and yield context.
Engineering decision support
Review paths, confidence indicators, and possible next steps.
Cross-tool intelligence
Signals connected across metrology, process, MES, SPC, and yield.
Yield-focused investigation
Earlier issue detection and clearer process-drift context.
Bring fab data into one intelligence workflow.
See how Zigoraat supports defect analysis and engineering review workflows.
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